Madhya Pradesh Bhoj Open University 2010-2nd Sem Diploma Electronics
MSBTE Sample ques. Paper for Electronics Engineering Group
Second Semester
Subject Electronic components and applications(12031)
E- SC HEME
Instructions:
Sample Question Paper
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Semester : Second Subject Title : Electronic components and applications Duration : 3 Hrs. |
12031
Max Marks: 100
1. All questions are compulsory.
2. Illustrate the answer with neat sketches whether wherever necessary.
3. Figures to the right indicate full marks.
4. Assume suitable data if necessary.
Q.l Attempt any TEN of the following. 20 Marks
a) State significance of power rating of resistor.
b) Draw constructional diagram and name various parts of wire wound resistor.
c) Draw the equivalent circuit of resistors.
d) Draw neat diagram of aluminum Electrolytic capacitor.
e) Define C/V ratio.
0 Define permeability and reluctivity of magnetic material.
g) Explain NO. NC contact of relay with neat diagrams.
h) Draw common cathode display.
i) State two merits and two demerits of IC. j) State two disadvantages of SMD.
k) List any two types of laminates used in P.C.B.
1) State the percentage composition of lead and tin for soldering electronic components. Q.2 Attempt any FOUR of the following. 16 Marks
a) Compare TDR and LDR on the basis of operating principles, material used, characteristic curves and application.
b) Find out the value of following capacitors
ii. Yellow Yiolet Yellow, iii. 223, iv. 0.33
i. IK,
c) Differentiate between Iron core and ferrite core inductor on the basis of loss and applications.
d) State the relation between self and mutual inductance. Give definitions.
e) Compare between LED and LCD on the basis of power required, operating frequency, response time, colour.
0 State the basic requirements of soldering flux.
Q.3 Attempt any FOUR of the following. 16 Marks
a) State the properties and applications of video connector.
b) What will happen if unshielded cables are used for high frequency applications?
c) Draw neat sketch of Push to ON and Push to OFF switch.
d) Draw neat sketch of general purpose relay and name different parts.
e) State the advantages and applications of SMD.
0 List & Draw different packages of IC.
Q.4. Attempt any FOUR of the following 16 Marks
a) State the significance of SSI. MSI. LSI and VLSI with respect to I.C.
b) Differentiate between relay and switch.
c) State and explain specifications of cable.
d) Distinguish between active and passive components.
e) Find the value of following resistors
i. 100E, 10% ii. Gray red red silver iii. 3M5, 2%, iv.R56K
f) Draw and explain the construction of mica trimmer and give application.
Q.5 Attempt any FOUR of the following. 16 Marks
a) Draw the P.C.B. artwork for following electronic circuit.
b) Which type of P.C.B. is preferred in high density electronic circuit? Why?
c) Draw a diagram of 5x7 dot matrix array with reference to LED.
d) Explain the working principle of dry reed relay with neat diagram.
e) Explain the construction of carbon film resistor with neat diagram.
0 Draw and explain SMD packages.
Q.6 Attempt any FOUR of the following 16 Marks
a) State four general rules to be taken care of while preparing artwork of P.C.B.
b) Differentiate between thick and thin film ICs on the basis of manufacturing techniques and thickness of film.
c) What are the different defects that occurred during soldering?
d) Draw a neat sketch of D connector and give its applications.
e) Explain step by step procedure for soldering.
0 Draw the flowchart for preparation of PCB.
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| Earning: Approval pending. |
